Audio Driver and Firmware Engr - 566452 Description In this position, you will become part of Ultra Mobile Platform Engineering team at Bangalore responsible for delivering the design and/or software stack for a new generation mobile platform based on low power technologies. The team's mission is to deliver a set of extended ingredient software components that provide value-add features for the platform differentiation. Your responsibilities will include but not be limited to:
- Designing, developing and delivering core and value-add features in the platform software (application and/or system software components)
- Executing the business processes necessary to deliver the components for software releases to UMG
Qualifications
You should possess a Bachelor of Engineering degree or a Master of Science degree in Computer Engineering or Electrical Engineering. Additional qualifications include:
- Proficient in C and/or C++, Windows system level programming including multithreaded development concepts
- Windows* or Unix* middleware development experience with good understanding of Windows kernels and hardware driver interaction concepts
- Keen passion and/or interest in system software development on Windows*
- Assertive and knowledgeable about product development life cycle
- Good problem solving skills
- Good team player
- A quick learner, self-motivated to work independently on designing new software
- Excellent communication skills (both written and verbal)
- Knowledge or development experience on Linux* would be an added advantage
- Experience with working on Low Power systems and/or Always Connected systems would be an added advantage
Job Category: Engineering
Primary Location : India-India, Bangalore
Full/Part Time: Full-time
Job Type: Internship
Regular/Temporary: Regular
Apply Before: May 26, 2010
Business Group
Employees in Intel's Mobile Platforms group design and implement the Intel� mobile technology used in notebook computers, phones, ultra-mobile PCs and other portable devices. Intel's industry leading technology includes processors, chipsets, Enhanced Data for GSM Environment (EDGE), Universal Mobile Telecommunications System (UMTS), High-Speed Downlink Packet Access (HSDPA), Wi-Fi and WiMAX wireless radios. These industry-leading technologies are driving the new mobile era of semiconductors, where people will carry their computing with them, making it truly personal. This group is growing very quickly, and has the broadest set of mobile and wireless technologies in the industry. Ultra Mobile Platform Engineering (UMPE) is part of Intel's Mobility Group. UMPE is responsible for delivering a software stack comprising system software and application components for a new generation mobile platform based on cutting edge low power technologies. The UMPE team in India is chartered to provide two critical functions for the emerging Ultra Mobile PCs (that combine performance and/or capability of the PC with mobility of the Handheld). - Drive platform innovation that provides value-add features and differentiation - Develop new higher level integration architectures and tools necessary to simulate its performance, power and thermal analysis
Posting Statement: For U.S.: We will accept applications/resumes until 45 days after posting date or earlier at Intel’s discretion.
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